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High density 3D integrated silicon capacitor

　　Two years later, the passive Integated Conjoined Substrate (PICS) project (funded by the EU's Seventh Framework Programme to fund research on the interests of SMEs), three European SMEs, IPDiA, Picosun headquarters and SENTECH instruments CEA-LETI and Fraunhofer IPMS-CNT announced major technological achievements during the program. Started in September 2013, the Pacific Island project focused on the development of innovative dielectric materials deposited by atomic layer deposition (ALD) and related tools (ALD batch tools and etching tools) to enable mass production of high density and high voltage new Technical 3D trench capacitor targets such as the medical or aerospace high-end market. 　　Recommended: 3D printing and conductive printing wire 　　Capacitors are the key components provided in each electronic module. The integrated silicon capacitor technology provided by SME IPDiA is superior to the temperature, voltage, aging resistance and reliability of the existing technology (using ceramic capacitors or germanium substrates), enabling the construction of highly integrated and high performance electronic modules. 　　The three major technical achievements of the consortium are: 1) An ALD batch processing tool was developed by Picosun headquarters and Fraunhofer IPMS-CNT. It is able to reduce cost ownership and high K dielectrics to provide better uniformity and step coverage to 3D structures. With its demonstration, optimization, and production-proven ALD process, Picosun is consolidating its position as a technology leader in the integrated circuit, semiconductor, and MEMS markets, from research and development to production systems. 　　2) A new method for accurately etching high-k dielectrics, which is a very specific material, as indicated by the help of SENTECH and Fraunhofer IPMS-CNT. As a result, SENTECH has acquired potential LEDs in high-k materials, which have market share for different applications, for example, high interest areas, MEMS, magnetic data storage. 　　3) Two new dielectric stacks were developed and integrated into IPDiA 3D trench capacitors with IPDiA, CEA-LETI and Fraunhofer IPMS-CNT. The initial specifications were met and the electrical measurements were certified. With a new record of capacitance density (> 500nF / mm2 at 3.3V) and extended operating voltage (10V with 150nF / mm2), it extends IPDiA to meet current market demand, particularly in the medical and aerospace sectors. ability. The qualification process initiates pre-requisite reliability studies during project implementation and will continue in the coming months. 　　Viewpoint: Ultra-fast switching power supply electronics with embedded technology 　　On top of these developments, another major goal of the PICS is the industrialization of this new integrated capacitor technology. Because of the partnership, manufacturability and financial viability are ensured by developing enough industrial tools for large-scale production. The Pacific Island project is a good example of the success of all three SMEs and the benefits of the EU-funded instrument "Study the interests of SMEs." SMEs are able to get a part of their research from the RTD performance of innovative knowledge and cutting-edge technology. The project was built to answer the specific needs of SMEs and the common goal is to set up new IPDiA capacitor technology requirements and specific tools for commercial development (ALD batch tools and etching).

2015

11-05

New semiconductor materials for solar cell technology unveiled

　　The University of Liverpool is part of an international research group that has proven to be able to "adjust" new semiconductor materials from solar cells, rather than using rare elements to exploit the rich content. 　　Semiconductors are vital to the electronics industry, everything from smartphones to solar panels, but they rely on rare elements such as germanium, gallium and indium, and have more and more attention beyond their cost and availability. 　　Researchers focused on compound zinc-tin nitride (ZnSnN2) have been recently synthesized by research groups around the world, using zinc and tin-metals, easily accessible through mature recycling facilities - rather than expensive and rare metals. 　　Working with compounds, they discovered an innovative tuning process, which means it could provide a possible replacement for semiconductor materials currently used in solar cells. 　　It is believed that the bandgap (a defining characteristic of a semiconductor) is too large for device applications such as solar cells. However, the researchers found that the bandgap of the alloy can be "tuned" to alter the perfectly ordered lattice by introducing zinc and tin atoms that are randomly distributed in the condition. 　　Dr. Tim Tamer, a physics reader and researcher at the University of Liverpool's Stephenson College of Renewable Energy, said: "The tuning power of such VCOs is usually alloyed, or mixed with other elements to achieve the desired results, but A system of other materials has been obtained, which is not necessary with ZnSnN2, given the recent discovery." 　　Dr. Steve Debin, a professor at the University of Western Michigan and chairman of the Department of Electrical and Computer Engineering, said: "We use a crystal growth technique called molecular beam epitaxy, which allows us to control the parameters by carefully adjusting Such as temperature and specific crystal mass. The atomic (or molecular) beam of the event. 　　Dr. Veal said: "By doing this, the team has been able to observe the number of samples of a wide range of conditions and to correlate this with a significantly lower bandgap energy - this material paving is considered for solar cell applications." 　　The study was funded by the UK Engineering and Physical Sciences Research Council and the National Science Foundation and published in the journal Advanced Energy Materials.

2015

11-05

Semiconductor silicon wafers rise again

　　Sino-US Silicon Crystal, a manufacturer of solar and semiconductor silicon wafers, pointed out that due to the shortage of semiconductor silicon wafers, it will increase the price of 3%~10% of silicon wafers in the first quarter, and increase the price by 3%~5 in the second quarter. %. 　　Sino-US Silicon Crystal said that the current global semiconductor market demand is strong, driving the upstream semiconductor silicon wafers in short supply, except for the first quarter due to the reaction cost, the price will increase by 3% to 10%, it is expected that the second quarter capacity gap is still high, the price has Opportunities will increase by 3% to 5%. Orders prior to the third quarter are now full.

2015

11-05

Chinese consumer electronics products target the Brazilian market

　　Xinhuanet São Paulo, November 5 (Reporter Yan Wei Wang Zhengrun) São Paulo Consumer Electronics Show opened on the 3rd in the Afghan Convention and Exhibition Center in Sao Paulo, Brazil's largest city. Many manufacturers from the Pearl River Delta region in China intend to open up the Brazilian market and look for “going”. Going out of the new growth point. 　　The three-day exhibition is one of the opening activities of the “Sao Paulo Technology Week” hosted by the São Paulo City Government. It is also the only technology product expo in the Technology Week. The exhibits are mainly consumer electronics products, including information and communication products, camera audio multimedia, and household appliances. As well as lighting products, the featured exhibition area includes drones, 3D printers and smart wearable devices; 　　On the first day of the exhibition, the performance of the featured exhibition area became the biggest highlight. The 3D printing performance and drone demonstration flight attracted the attention of many Brazilian visitors, let them appreciate the charm of China's “intelligence”. 　　According to Pan, the deputy general manager of the China (Brazil) Investment Development and Trade Center, the Brazilian consumer electronics market has been growing steadily over the past few years. In 2014, the Brazilian consumer electronics market generated sales of USD 65.4 billion, and the market size accounted for 44% of the South American market. %, China's power electronics exports to Brazil totaled 15.7 billion US dollars, accounting for 38% of Brazil's imported power electronics products. Although the market may be slightly shrinking due to the economic recession this year, the consumption is still rising, and it is expected to reach 117 million pieces. 　　In addition to the leading enterprises in the industry, many small and medium-sized enterprises are actively participating in this exhibition. A representative of a manufacturer producing driving recorders told reporters that the current economic downturn in Brazil is actually a good thing for some small and medium-sized export enterprises in China, and the participation of large enterprises is declining. It is precisely when small and medium-sized export enterprises emerged. On the one hand, competition is relatively less intense, and on the other hand, middle and low-end consumer electronics products are more in line with the current consumer demand in the Brazilian market.

2015

11-05

Light-emitting capacitive switch for medical monitors

　　A single LED lighting capacitive switch module has proven to be a vital component of medical device manufacturers, said Stadium IGT, which introduced a range of switch modules. 　　The company approached the medical OEM to provide a new HMI solution for high performance acute fetal and maternal production surveillance systems. The final product uses advanced technology to obtain accurate data. It must also be easy to use and provide data that is quickly read. 　　The single illuminating capacitor switch module provides an on/off pulse under high light indication that the product is energized. The ultra-thin design allows the module to be mounted on the control panel, ensuring an aesthetically pleasing display that can withstand the rigorous cleaning of the desired clinical environment. 　　It offers greater touchscreen sensitivity, saying the company has no missed operations and creates better light shaping and backlighting from LED light diffusing films. The module is connected via an adhesive pad mounting and plug-in FFC cable and can be customized to meet the space constraints of the final product. 　　Light-emitting capacitive switch for medical monitors

2015

11-05

Electronic components industry or low rise

　　In the fourth quarter of 2008 and early 2009, the global electronic components industry experienced a rapid decline, and the industry boom and company performance fell to the bottom. Although from the first quarter of this year to the semi-annual performance, it still shows a year-on-year decline, but the monthly operation has shown a significant upward trend, and the overall situation can be summarized as a low recovery. 　　The decline in demand for global electronic products brought about by the financial crisis is the main reason for the rapid decline of the electronics manufacturing industry in this round. In addition, the cyclical adjustment of some sub-sectors itself is one of the factors that lead to the decline of company performance. The decline in vendor shipments is not entirely due to lower final demand. Agents and other industrial chain intermediate links have reduced their inventories due to lack of confidence in future demand and as much as possible to maintain a reasonable cash flow situation, and have also contributed to the decline in shipments of electronic products. 　　This year, the state has successively issued a series of supporting policies and measures related to electronic components and their upstream and downstream, such as the adjustment and revitalization plan of the electronic information industry, home appliances to the countryside, trade-in, and reduction of export value-added tax. Both will bring opportunities to the electronic components industry. 　　The current challenges facing the electronics manufacturing industry have prompted companies to begin to examine their technology and industry positioning, actively adjust their development strategies, and improve their competitiveness. In this context, corporate mergers and acquisitions, asset restructuring and other behaviors are more than in the past. 　　In 2009, the investment in electronic components companies tends to be cautious, but the capacity utilization rate of most companies has rebounded. 　　In the first quarter of this year, although the overall performance of the electronic components industry was not satisfactory, in fact, most companies that achieved profitability. The reason is that most of the profit of the profitable company has dropped by a large margin, while the amount of the loss-making company is large, resulting in a negative total net profit. At the same time, the utilization rate of sub-sectors such as semiconductor materials, device manufacturing, packaging, and magnetic materials has recovered in the first quarter, and the capacity utilization rate of some companies has increased rapidly. 　　Although many companies in the first quarter indicated that their business conditions are improving month by month, the overall performance of the industry is still down from the fourth quarter of 2008, which is already considered to be very poor. There are two main reasons for this: First, the starting point is low. Due to factors such as declining demand and downstream destocking, the industry was at its lowest level at the end of last year and at the beginning of this year. Although some companies' capacity utilization rate improved significantly in February and March, the starting point was too low and the performance was dragged down. The second is the seasonal factor. The first quarter is the off-season of most sub-sectors, and includes New Year's Day and Chinese New Year holidays, which have a certain impact on performance. 　　Due to the poor performance in the first quarter, the proportion of companies with pre-loss and pre-fall in the first half of the year is still more than half. If the overseas market cannot enter the recovery channel relatively quickly, the growth rate in the third and fourth quarters will gradually decrease. In the third quarter, the overall year-on-year growth is still difficult. In the fourth quarter, it is expected to achieve positive growth due to the sharp decline in industry performance in the same period last year. For the full year, achieving year-on-year growth in revenue and profit is difficult for most companies.

2015

11-05

　　Weihai Xinjia Electronics Co., Ltd. is located in the beautiful high-tech industrial development zone of Weihai City with beautiful scenery and pleasant scenery. It is a high-tech enterprise in Shandong Province that integrates R&D, production and marketing of power electronics products such as IGBT, thyristor, rectifier module, IPDM intelligent power drag module and application machine. It has a number of patented technologies and independent intellectual property rights. He has undertaken a number of national, provincial and ministerial-level scientific research projects and cooperated with relevant institutes to complete military product development plans. Among them, the intelligent high-power power consignment module project is the SME Innovation Fund Support Project of the Ministry of Science and Technology and the National Torch Program Project. 　　The registered capital of the company is 20 million yuan. It covers an area of 20,900 square meters in the Torch Hi-Tech Industrial Development Zone of Weihai City. It has a professional production plant of 6,309 M2. It has nearly 100 sets of high-performance power semiconductor equipment and instruments imported from Germany and the United States. A professional production line consisting of auxiliary facilities. Adopting international advanced production technology and high-quality power semiconductor chip to produce IGBT, thyristor, rectifier bridge module, IPDM series intelligent electric drag module, single-phase, three-phase solid state relay and rectification, voltage regulation, power adjustment device, etc. Machine products. Through more than ten years of development, it has created a group of skilled and highly skilled employees, with research and development and production capacity of intelligent high-tech products. The company has passed the ISO9001: 2000 international quality system certification, the products have passed the inspection of the national industry testing center, and some products have passed the EU CE safety certification. It has a stable customer base, mainly in the middle and high-end products market, and exports to the United States, Russia, Israel, Australia, South Korea, Thailand, Singapore and other countries. 　　The company adheres to the development strategy of “innovation” and “seeking good” into the world, and is committed to continuous innovation and continuous improvement of products, pursuing continuous improvement of quality and manufacturing of the most “good” products. At present, the company is investing new funds, introducing international advanced equipment technology, and building a power semi-transformed module production line with IGBT modules as the main body, providing customers with high quality and low cost power semiconductor module products. 　　The company sincerely welcomes all colleagues and customers to visit us, we will provide you with excellent and honest service.

2015

11-05

Attenuator provides smooth frequency response up to 40 GHz

　　The Linked Medium High Power Attenuator provides a 26.5 flat response to 40 GHz over the entire specified frequency band and is suitable for testing military or commercial Ka-band satellite communication systems. 　　The attenuation level can range from 10 to 30 dB in the AM28J-XXMP series of devices. To perform up to 100W CW to measure microwave power processing capability in any TWT (traveling tube) or solid state 　　High power amplifier. The attenuator uses the advanced 1.15 low standing wave ratio of the highest: 1. 　　Selected from WR28 waveguide components, internal ceramic loading and external cooling fins for optimum heat dissipation, the compact attenuator has an end profile size of only 78.5 x 29.5 mm including the heat sink, with length specified by The attenuation level changes. 　　These devices are manufactured in lightweight aluminum alloy with Iridite coating and satin black finish. UBR320 flanges are standard; other flange styles are available upon request. 　　Attenuator provides smooth frequency response up to 40 GHz

2015

11-05

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