Two years later, the passive Integated Conjoined Substrate (PICS) project (funded by the EU's Seventh Framework Programme to fund research on the interests of SMEs), three European SMEs, IPDiA, Picosun headquarters and SENTECH instruments CEA-LETI and Fraunhofer IPMS-CNT announced major technological achievements during the program. Started in September 2013, the Pacific Island project focused on the development of innovative dielectric materials deposited by atomic layer deposition (ALD) and related tools (ALD batch tools and etching tools) to enable mass production of high density and high voltage new Technical 3D trench capacitor targets such as the medical or aerospace high-end market.

　　Recommended: 3D printing and conductive printing wire

　　Capacitors are the key components provided in each electronic module. The integrated silicon capacitor technology provided by SME IPDiA is superior to the temperature, voltage, aging resistance and reliability of the existing technology (using ceramic capacitors or germanium substrates), enabling the construction of highly integrated and high performance electronic modules.

　　The three major technical achievements of the consortium are: 1) An ALD batch processing tool was developed by Picosun headquarters and Fraunhofer IPMS-CNT. It is able to reduce cost ownership and high K dielectrics to provide better uniformity and step coverage to 3D structures. With its demonstration, optimization, and production-proven ALD process, Picosun is consolidating its position as a technology leader in the integrated circuit, semiconductor, and MEMS markets, from research and development to production systems.

　　2) A new method for accurately etching high-k dielectrics, which is a very specific material, as indicated by the help of SENTECH and Fraunhofer IPMS-CNT. As a result, SENTECH has acquired potential LEDs in high-k materials, which have market share for different applications, for example, high interest areas, MEMS, magnetic data storage.

　　3) Two new dielectric stacks were developed and integrated into IPDiA 3D trench capacitors with IPDiA, CEA-LETI and Fraunhofer IPMS-CNT. The initial specifications were met and the electrical measurements were certified. With a new record of capacitance density (> 500nF / mm2 at 3.3V) and extended operating voltage (10V with 150nF / mm2), it extends IPDiA to meet current market demand, particularly in the medical and aerospace sectors. ability. The qualification process initiates pre-requisite reliability studies during project implementation and will continue in the coming months.

　　Viewpoint: Ultra-fast switching power supply electronics with embedded technology

　　On top of these developments, another major goal of the PICS is the industrialization of this new integrated capacitor technology. Because of the partnership, manufacturability and financial viability are ensured by developing enough industrial tools for large-scale production. The Pacific Island project is a good example of the success of all three SMEs and the benefits of the EU-funded instrument "Study the interests of SMEs." SMEs are able to get a part of their research from the RTD performance of innovative knowledge and cutting-edge technology. The project was built to answer the specific needs of SMEs and the common goal is to set up new IPDiA capacitor technology requirements and specific tools for commercial development (ALD batch tools and etching).