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High density array cable assembly

Classification:
Company news
2015/11/05
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Review:
[Abstract]:
  Samtec's SEARAY 0.80 mm pitch, ultra-high-density array cable assembly provides 50% board space compared to a 1.27 mm pitch SEARAY system.

  With a performance of 15 Gbps and a total edge rate contact of up to 300, the cable system is designed for rugged, high-speed applications where space is limited.

  The 0.80mm pitch ESCA series offers a 50Ω single-ended signal routing on the #34 AWG microstrip coaxial cable with 8 rows of 20 or 30 contacts and 10 rows per design. The cable assembly has a 4:1 ratio of signal to ground, optional screw undulations and a minimum cable length of 5 cm.

  Both ends are available with sockets and terminals. Board level teammates (SEAM8 / SEAF8) are designed for 2mm to 5mm body height flexibility and standard lead-free solder toll terminals simplify IR reflow termination and improve solder joint reliability.

  Some feature edge rate contact systems increase cycle life and reduce wide-side coupling, which reduces crosstalk for superior signal integrity performance and impedance control. This sturdy contact system is also not easily detached during the process of damage, "zipper".

  High density array cable assembly

  Samtec's SEARAY 0.80 mm pitch, ultra-high-density array cable assembly provides 50% board space compared to a 1.27 mm pitch SEARAY system.

  With a performance of 15 Gbps and a total edge rate contact of up to 300, the cable system is designed for rugged, high-speed applications where space is limited.

  The 0.80mm pitch ESCA series offers a 50Ω single-ended signal routing on the #34 AWG microstrip coaxial cable with 8 rows of 20 or 30 contacts and 10 rows per design. The cable assembly has a 4:1 ratio of signal to ground, optional screw undulations and a minimum cable length of 5 cm.

  Both ends are available with sockets and terminals. Board level teammates (SEAM8 / SEAF8) are designed for 2mm to 5mm body height flexibility and standard lead-free solder toll terminals simplify IR reflow termination and improve solder joint reliability.

  Some feature edge rate contact systems increase cycle life and reduce wide-side coupling, which reduces crosstalk for superior signal integrity performance and impedance control. This sturdy contact system is also not easily detached during the process of damage, "zipper".

  High density array cable assembly